This new Mini Mirror allows the user to be able to inspect solder joints
of a BGA component before and after the reflow / rework process. This
will permit the operator to be able to visually inspect the outer row of
solder spheres to determine proper wetting of the solder joint.
The flexibility of the tool allows the user to be able to change the
angle of the Mini Mirror so that the solder sphere connection to the
package as well as the PCB can be seen.
The Mini Mirror's field of view is .700 inches wide. When you consider
that all of these advantages are available at this price, the Mini
Mirror is clearly without equal. Keep in mind that when it comes to
visual inspection . . . SIZE COUNTS.
(MM-1)- The
Mini Mirror at Work
Allows the operator to inspect the solder joints of BGA components
before and after the rework-reflow process.
The photos
below show that the wide field of view of the Mini Mirror permits
outstanding images as compared to other tools that are on the market at
over 5 times the Mini Mirror price.