■ Electromagnetic pump (Option)

□ Solder flow by electromagnetic. It flow evenness steadily, almost

non-oxidation.

□ Titanium alloy solder bath: suitable for lead-free solder.

□ Adopted the strengthen soakage spout  can greatly reduce the SMT

element soldering defect.

□ Motorized mechanism for solder bath: the electric lifter can

raise/lowers the soldering bath for easy maintenance. The bath can also

be automatically drawn out.

■ Circular Hot Wind Preheating

□ Preheating circularly for PCB , controlling the temperature accurately.

□ Preheating is symmetrical and speedy.   

□ Flux system constant pressure and flow, it can be changed rapidly

without maintenance, it is very safe.

□It armed with stepping motor.  

■ Nitrogen System

□ Nitrogen system can effectively prevent the naked pad and solder

from oxidization, improve the wetting and flowing ability

□ Nitrogen flux control and oxygen analysis system, easy to adjust.

■ Controlling System

□ Dual controlling system, easy to used, its dependability is the best.

□ Win98 operating system, user friendly interference.

■ Cooling System

□ External high-power water-cooling system makes quick cooling

process (cooling temperature≤ 8℃), the solder point smooth and

shining, temperature of the PCB at exit is less than 60℃.

□ Cooling speed: 8-10℃/sec.