VisionMaster is a sophisticated 3-dimensional solder paste measurement system coupled with an intuitive Windows® user interface, and packaged in a rugged, bench-top system designed for the electronics production floor.  With only a few minutes training, an operator can perform accurate 3D measurements of solder paste pads, BGA's and many other PCB features.  VisionMaster's completely automatic solder paste measurement process eliminates operator errors and offers excellent measurement repeatability.

Today's contract manufacturers are facing ever changing board designs, along with smaller component sizes.  This places a greater emphasis on the solder paste printing process, and requires the engineer to have a control process in place.  The ease, as well as the superb accuracy and repeatability, of the VisionMaster solder paste inspection system makes it a perfect fit for the company with either one or multiple lines.